XIAO-ESP32-C3 Case

The XIAO‑ESP32‑C3 Breadboard Compatible Case is a custom‑designed protective enclosure built for makers who want a clean, reliable housing for their projects. Sized at 1.05in × 0.96in × 0.48in and weighing only 4 grams, it keeps your components secure without adding unnecessary bulk. This case is fully compatible with standard breadboards, giving you the flexibility to prototype, test, and deploy your XIAO‑ESP32‑C3 projects exactly the way you want. All ports, buttons, and connectors remain accessible for easy use during development. Each unit is 3D printed in matte PETG at a 0.12mm layer height, offering a balance of durability and clean surface finish. PETG is chosen for its UV resistance, impact strength, and thermal stability — ideal for long‑term use on the bench or in the field. Please note: this listing includes the 3D‑printed case only. The computer or development board shown in photos is sold separately. For bulk orders, please visit MoseleysDesigns.com.

• Compact and lightweight design. 1.05in × 0.96in × 0.48in, 4 grams
• Fully breadboard compatible for seamless prototyping and testing
• All ports, buttons, and connectors remain fully accessible
• 3D printed in matte PETG at 0.12mm layer height for durability and a refined finish
• PETG construction offers UV resistance, impact strength, and thermal stability
• Bulk ordering available at MoseleysDesigns.com